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Copy file name to clipboardExpand all lines: CUDA_ROCM_FEATURES.md
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@@ -68,24 +68,29 @@ Highlights from AMD’s official docs (see links):
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- ROCm 7.0.1 is the latest as of 2025‑09‑17; consult the release history for point updates.
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- HIP as the primary programming model, with CUDA‑like APIs and HIP‑Clang toolchain.
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- Windows support targets HIP SDK for development; full ROCm stack targets Linux.
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- Libraries are provided under the ROCm organization (rocBLAS/hipBLAS, rocFFT/hipFFT, rocSPARSE/hipSPARSE, rocRAND/hipRAND, rocSOLVER/hipSOLVER, rocPRIM/hipCUB, rocThrust, etc.).
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-ROCm Libraries monorepo: multiple core math and support libraries are consolidated in the ROCm Libraries monorepo for unified CI/build. Projects included (as of rocm‑7.0.1): composablekernel, hipblas, hipblas-common, hipblaslt, hipcub, hipfft, hiprand, hipsolver, hipsparse, hipsparselt, miopen, rocblas, rocfft, rocprim, rocrand, rocsolver, rocsparse, rocthrust. Shared components: rocroller, tensile, mxdatagenerator. Most of these are marked “Completed” in the monorepo migration status and the monorepo is the source of truth; see its README for current status.
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- Tooling and system components: ROCr runtime, ROCm SMI, rocprof/rocprofiler, rocgdb/rocm‑debug‑agent.
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Nomenclature: project names in the monorepo are standardized to match released package names (for example, hipblas/hipfft/rocsparse instead of mixed casing).
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Architectures (illustrative, not exhaustive):
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- CDNA3 (MI300 family): AI training and HPC; unified memory on APUs (MI300A), large HBM configs (MI300X).
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