ATPlace2..5D 🌟

This repository contains the public materials for the ICCAD 2024 paper ATPlace2.5D. Due to intellectual property restrictions, we are unable to directly provide the core code of ATPlace 🔒. However, this repository includes the following resources:

1. Test Cases: A set of test cases used in our experiments.
2. Thermal Configuration: The thermal setup used in our work, which is processed using HotSpot. You can compile HotSpot-7.0 on your own 💻.
3. Partial Code: A subset of the TAP2.5D codebase 🧩.

In the future, we plan to release a compiled version of the ATPlace code to further support research in this area 🚀.

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Repository Contents 📂

Test Cases

The test cases are organized into 10 folders (Case1 to Case10), each containing the following files:

• Chiplet Geometric Sizes: *.blocks files that define the geometric sizes of chiplets.
• Nets: *.nets files that describe the netlist connectivity.
• Pin Locations: *.pl files that specify the pin locations.
• Chiplet Power: *.power files that define the power consumption of chiplets.

These files are formatted based on the Bookshelf format, a widely-used standard in placement research. The parsers can be fount in `utils'.

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Thermal Configuration 🔥

The thermal modeling is performed using HotSpot-7.0, an open-source thermal modeling tool. To use the thermal configuration provided here, follow these steps:

1. Clone or download HotSpot-7.0 from its official repository at https://github.com/uvahotspot/HotSpot.git.
2. Compile HotSpot-7.0 on your system.
3. Use the thermal configuration files provided in this repository as input to HotSpot.

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Future Plans 🤝

We are committed to open-sourcing more components of ATPlace in the future. Specifically, we plan to release a compiled version of the ATPlace code to enable researchers to reproduce and build upon our work.

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How to Use This Repository 🛠️

1. Clone the repository:

   git clone https://github.com/Brilight/ATPlace_pub.git

2. Explore the test cases in the cases directory.
3. Set up HotSpot-7.0 and use the provided thermal configuration files for thermal modeling.
4. Results can be compared with the published data in our paper.

Citation 📋

If you find this repository useful for your research, please consider citing our ICCAD 2024 paper:

@inproceedings{wang2024atplace2,
  title={ATPlace2. 5D: Analytical thermal-aware chiplet placement framework for large-scale 2.5 D-IC},
  author={Wang, Qipan and Li, Xueqing and Jia, Tianyu and Lin, Yibo and Wang, Runsheng and Huang, Ru},
  booktitle={Proceedings of the 43rd IEEE/ACM International Conference on Computer-Aided Design},
  pages={1--9},
  year={2024}
}

Contact

For questions or feedback, feel free to reach out:

Email: qpwang@pku.edu.cn GitHub Issues: Open an issue in this repository.