ATSim_pub

Public executable files and test cases of ATSim [publised paper at ISEDA24, ISEDA 25, ASICON 25]

Intro:

Thermal simulation plays a fundamental role in the thermal design of integrated circuits, especially 3D-ICs. Current simulators require significant runtime for high-resolution simulation, and dismiss the complex nonlinear thermal effects, such as nonlinear thermal conductivity and leakage power.

To address these issues, we propose ATSim3D, a thermal simulator for simulating the steady-state temperature profile of nonlinear and heterogeneous 3D IC systems. This repo includes [all the test cases] and [part of the source codes] of ATSim3D, while the remaining codes are not available for commercial reasons (in collaboration with industry).

Detailed algorithms and details can be found in our paper, which can be cited as:

@inproceedings{wang2024atsim, 
    title={ATSim3D: Towards Accurate Thermal Simulator for Heterogeneous 3D IC Systems Considering Nonlinear Leakage and Conductivity},
    author={Wang, Qipan and Zhu, Tianxiang and Lin, Yibo and Wang, Runsheng and Huang, Ru},
    booktitle={2024 International Symposium of Electronics Design Automation (ISEDA)},
    pages={1--6},
    year={2024}
}

Requirements:

0. Python >= 3.6

1. Numpy

2. pandas

3. scipy

4. tqdm

5. matplotlib

Usage

v1 General:

python ATSim3D.py --lcfFile /path/to/lcf_file --ConfigFile /path/to/config_file --SimParamsFile /path/to/simulator_file

**Description**
#lcf_file: describe the layer stacking config, from the bottom to the top in ascending order
#configfile: include the material conductivity and other relevant physical parameters
#simulator_file: include the parameters for the solver, especially grid resolutions

1. [2DIC]

python ATSim3D.py --lcfFile ../2DIC/Intel_ID1_lcf.csv --ConfigFile ../2DIC/Intel.config --SimParamsFile ../2DIC/SimParms.config

**Description**
The basic 2D-IC structure with two layers: silicon substrate and active layer, with the _flp.csv file describing the locations of all macros/blocks/stdcells inside, and the _power.csv file the dynamic and static power of corresponding itmes inside the _flp.csv.

2. [Mono3D]

python ATSim3D.py --lcfFile ../Mono3D/Mono3D_lcf.csv --ConfigFile ../Mono3D/Mono3D.config --SimParamsFile ../Mono3D/SimParms.config

**Description**
The monolithic 3D-IC structure with two active layers.

3. [TSV3D]

python ATSim3D.py --lcfFile ../TSV3D/TSV3D_lcf.csv --ConfigFile ../TSV3D/TSV3D.config --SimParamsFile ../TSV3D/SimParms.config

**Description**
The TSV-based 3D-IC structure with two active layers interconnected by a TSV array, the shape of which in flp_files/TSV_flp.csv.

v2 :

Binary Download from

https://disk.pku.edu.cn/link/AAAF77D1F3BA234AF5BD049F6AE5D02843 Name: ATSim3_5D Expires: Never

Usage:

./ATSim3_5D -xml -config --output_path